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The Kurt J. Lesker Company^® (KJLC^®), a global manufacturer of vacuum systems, thin film deposition tools and vacuum components, today announced that the United States Patent and Trademark Office has issued US patent number 9,695,510, 'Atomic Layer Deposition Apparatus and Process', covering the design of an atomic layer deposition system and the process to use that system to deposit highly precise and conformal thin films. This proprietary technology substantially reduces the interaction of various precursor gas molecules with the internal surfaces of the reaction chamber and enables actual focusing of gas streams to more effectively coat the surface of arbitrarily large substrates.

On 6 November 2017 our Jason Hrebik and J.R. Gaines delivered presentations at the 70th annual conference on Gaseous Electronics (GEC2017), held at the Doubletree Hotel, Green Tree, PA. Hrebik displayed his expertise through a presentation on the capabilities and benefits of the High Power Impulse Sputtering (HiPIMs) process and provided the audience with an introduction to the new KJLC Impulse™ power supply. The conference featured a group of presentations from industrial companies, including LAM Research, Applied Materials, and Tokyo Electron. Gaines capped off the afternoon session with a review of the practical issues associated with the integration and application of plasmas in Plasma-Enhanced Atomic Layer Deposition (PEALD).