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Tungsten Disilicide (WSi2) Sputtering Targets

Tungsten Disilicide (WSi2) Sputtering Targets Overview

Our comprehensive offering of sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website. Below you will find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. To speak to someone directly about current pricing or for a quote on sputtering targets and other deposition products not listed, please click here.

Tungsten Disilicide (WSi2) Specifications

Material TypeTungsten Silicide
SymbolWSi2
Melting Point (°C)>900
Theoretical Density (g/cc)9.4
Z Ratio**1.00
SputterRF
Max Power Density
(Watts/Square Inch)
15*
Type of BondIndium, Elastomer

* This is a recommendation based on our experience running these materials in KJLC guns. The ratings are based on unbonded targets and are material specific. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/Square Inch or lower, depending on the material.

* Suggested maximum power densities are based on using a sputter up orientation with optimal thermal transfer from target to the sputter cathode cooling well. Using other sputtering orientations or if there is a poor thermal interface between target to sputter cathode cooling well may require a reduction in suggested maximum power density and/or application of a thermal transfer paste. Please contact techinfo@lesker.com for specific power recommendations.

** The z-ratio is unknown. Therefore, we recommend using 1.00 or an experimentally determined value. Please click here for instructions on how to determine this value.

Notes:
  • special case note
    Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. Request more information, please click here.
  • special case note
    This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock. Please click here for Ramp Procedure for Ceramic Target Break-in.

SDS
Click here for the Tungsten Disilicide SDS.
Request A Quote
Can't find the size or material you need? Please use our Materials Quotation Form to request.
Deposition Materials FAQ
Click here for answers to some of the most common questions we are asked.
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Ordering Table

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Material Description Size Purity Compatible Guns Notes Part Number Price In Stock Add To Cart
Material Description Size Purity Compatible Guns Notes Part Number Price In Stock Add To Cart
Tungsten Disilicide Tungsten Disilicide Circular Sputter Target (1.0" Diameter x 0.125" Thickness, 99.95% pure) 1.00" Dia. x 0.125" Thick 99.5% Most Standard Guns 1 EJTWSIX251A2 P.O.R. Contact KJLC for Availability
Tungsten Disilicide Tungsten Disilicide Circular Sputter Target (1.0" Diameter x 0.250" Thickness, 99.95% pure) 1.00" Dia. x 0.250" Thick 99.5% Most Standard Guns 1 EJTWSIX251A4 P.O.R. Contact KJLC for Availability
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 2.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, HOT PRESSED 2.00" Dia. x 0.125" Thick 99.5% Most Standard Guns 1 EJTWSIX252A2 P.O.R. Contact KJLC for Availability
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 2.00" DIAMETER X 0.250" THICK, +/-0.010" ALL, HOT PRESSED 2.00" Dia. x 0.250" Thick 99.5% Most Standard Guns 1 EJTWSIX252A4 P.O.R. Contact KJLC for Availability
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 3.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, HOT PRESSED 3.00" Dia. x 0.125" Thick 99.5% Most Standard Guns 1 EJTWSIX253A2 P.O.R. Contact KJLC for Availability
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 3.00" DIAMETER X 0.250" THICK, +/-0.010" ALL, HOT PRESSED 3.00" Dia. x 0.250" Thick 99.5% Most Standard Guns 1 EJTWSIX253A4 P.O.R. Contact KJLC for Availability
Tungsten Disilicide Tungsten Disilicide Circular Sputter Target (5.0" Diameter x 0.250" Thickness, 99.95% pure) 5.00" Dia. x 0.250" Thick 99.5% Most Standard Guns 1 EJTWSIX255A4 P.O.R. Contact KJLC for Availability
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 Notes: 
1.
Dimensions vary by sputtering gun. Review sputtering gun manual to determine appropriate target size.

Bonded Assemblies Ordering Table

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Material Description Target Size Purity Bonding Type Backing Plate Size Compatible Guns Notes Part Number Price In Stock Add To Cart
Material Description Target Size Purity Bonding Type Backing Plate Size Compatible Guns Notes Part Number Price In Stock Add To Cart
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 2.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, HOT PRESSED, INDIUM BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 2.00" DIAMETER X 0.125" THICK, +/-0.010" ALL 2.00" Dia x 0.125" Thick 99.5% Indium 2.00" Dia x 0.125" Thick Most Standard Guns 1 EJUWSIX252A4 P.O.R. Contact KJLC for Availability
Tungsten Disilicide TUNGSTEN DISILICIDE TARGET, WSi2, 99.5% PURE, 4.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, HOT PRESSED, ELASTOMER BONDED TO COPPER BACKING PLATE, OFHC 101, Cu, 4.00" DIAMETER X 0.125" THICK, +/-0.010" ALL, W/ KEEPER AND SCREW, FOR 4" TORUS MAG KEEPER 4.00" Dia x 0.125" Thick 99.5% Elastomer 4.00" Dia x 0.125" Thick TORUS Mag Keeper 4 2 EJUWSIX254TK4 P.O.R. Contact KJLC for Availability

 Notes: 
1.
Dimensions vary by sputtering gun. Review sputtering gun manual to determine appropriate target size.
2.
Bonded assemblies to be used in TORUS Mag Keeper guns require Elastomer bonding.
Target & Backing Plate Service Form

Target & Backing Plate Service Form

KJLC offers bonding services for both KJLC and customer supplied targets and backing plates. Please fill out our Target & Backing Plate Service Form to acquire a return authorization number.

Target & Backing Plate Service Form
Contact Us - Tungsten Disilicide WSi2 Sputtering Targets