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Sputter Source Diagnostics Form

Please provide a detailed description of the problem:

What troubleshooting, if any, was attempted to fix the problem:

System Serial Number:

Sputter Target material:

Is the Target bonded? :

Yes No

If yes, what is the type of bond:

Target diameter:

Target thickness :

Source # with issue:

Base pressure before sputtering process:

<1.0 E-6 Torr
<1.3 E-6 mBar
<1.3 E-4 Pa

Coolant/water flow rate through sputter source:

Must be > 0.5 gpm (> 1.9 l/min)

Has the sputter source worked before?:

Yes No

If yes, what is the maximum power the target has been run previously?:

Using DC or RF power?:

DC RF

Enter parameters the last time it ran below

DC parameters:

Voltage (V):

Current (mA):

Was DC voltage stable throughout the entire deposition?:

Yes No
A steady increase in DC voltage during deposition indicates the target overheating. Check target flatness. Also, consider applying silver paste to improve thermal transfer fromthe target to the copper cooling well of the sputter source.

If no,

please explain:

RF parameters:

Were RF parameters stable throughout the entire deposition? :

Yes No

If no,

please explain:

FWD power (W):

REF power (W):

DC Bias Voltage / DCBV (V):

Tune (%):

Load (%):

Issues lighting plasma?:

Yes No

Is the target shutter open? :

Yes No

Is the initial power setpoint > 30 W :

Yes No

Capacitance manometer (Capman) reading when at base pressure?:

Zero the capacitance manometer if at >0.3 mTorr (>4.0 E-4 mbar or >4.0 E-3 Pa)

Argon MFC flow rate to light plasma:

sccm
Try using flow control mode and inputting max flow rate, typically that is 139 sccm for argon

Argon pressure to light plasma:

> 10 mTorr
> 0.013 mBar
> 1.3Pa

Are you reactively sputtering? :

Yes No

If yes:

What reactive gas?:

Always light with pure argon and introduce reactive gas after pressure reduction

DC parameters:

Potential issues (based on your selection above)

Open load- target got too hot killing magnets, inner and outer magnets are not reverse poled, bad power delivery connections, or target too thick
Shortened resistance < 200kΩ from target to source body- clean magnets and shields of debris
Shortened resistance < 200kΩ from target to source body- clean magnets and shields of debris

If you selected 'Other', please enter the parameters below

If you selected 'Other', please enter the parameters below:

DC Bias Voltage / DCBV (V):

More than one power supply or matching network?:

Yes No

Have you tried using a different power supply or match network on the target in question?:

Yes No

Can the power supply light other sputter targets?:

Yes No

Have you tried lighting the target while plasma is lit on a different working sputter source?:

Yes No

Please take the following photographs of the system:

Inside of the process chamber
Picture of sputter source (with shutter open and no components removed)
Picture of sputter plasma
Picture of the system description tag found on the rear of the electrical rack
(Please see photo for example)

Please attach the photos of the system here:

Attach Files

max size per file: 10mb