Super-SPECTROS™ 200
Thin Film Deposition System Platform
Super-SPECTROS™ 200
Organic Thin Film Deposition & Metallization System up to 200mm x 200mm Substrate
Overview
- Optimized for organic material deposition
- Up to 12 LTE sources; 1cc, 10cc or 35cc capacity
- Host to dopant ratio 1000:1
- Up to 4 thermal evaporation sources
- Substrate shutter
- Automatic substrate, mask storage and exchange
- Pyrometer port
- Glovebox interfaceable design with sliding front door and sliding rear door
- KJLC eKLipse™ control software
- Rate control resolution 0.05Å/s
- Recipe based PC based system controls
- Cryopump high vacuum pumping
- 2-position gate valve
Options
- Wedge tool for shaped film growth
- Co-deposition
- Electron beam source
- Twelve source thermal evaporation source array
- Caesium, Selenium, or HTE source
- Load lock chamber
- Plasma clean
- 3-position gate valve
- In-situ source material replenishment
- Substrate rotation, heating and cooling
- KJLC adaptor box and 2-port or 4-port glovebox
- Turbomolecular pumping
- Datalogging
Applications
- Organic Semiconductor
- Nanoscale Devices
- Metal Cathode Deposition
- Organic Films
- Organic Electronics and Photovoltaics (OPV)
- OLED
- OLED Lighting
- Organic Electronics
- Integrated Smart Systems
- Thin Film Batteries
- MEMS/NEMS
Specifications
Process Chamber
UHV grade, 304 stainless steel, nominally 24" wide x 24" deep by 40" tall
Framework
Steel construction, enclosed panel base with open chamber access, fully enclosed electronics cabinet
Vacuum Pumping
Brooks 1500 l/s cryo pump with oil-free backing pump standard (8x10-8 mbar base pressure)
Vacuum Valves
VAT 2-position pneumatic HV valve. Optional VAT 3-position pneumatic HV valve. All others are KJLC HV valves
Pressure Measurement
Pfeiffer 685 L/s turbomolecular pump with an Adixen 2010SD oil sealed roughing pump. Base pressure for a properly conditioned chamber is 2 x 10-7 torr (2.67 x 10-7 mbar)
Vacuum Interlocks & Venting
Automatically sequenced vent control & vacuum interlock for process chamber
Deposition Uniformity
≤±3% on a 10" (250mm) diameter or 8"(200mm) x 8"(200mm) Si wafer with a 5mm edge exclusion as measured on an AlQ3 or Al film of >200nm thick
Low Temperature Source
KJLC design low temperature evaporation (LTE) source for controlled deposition of materials up to 600°C
Substrate Platen
Platen for up to 8" (200mm) diameter or 8"(150mm) x 8"(150mm), available with 20 rpm rotation, substrate heating up to 350°C, cooling to -10°C, and RF plasma clean/etch via the substrate shutter. 5-shelf cassette for substrate and mask storage with exchange
Film Thickness Control
Film thickness and deposition rate control enabled via system software and controller (no 3rd party hardware required)
System Control
KJLC eKLipse™ software PC-based HMI manual computer control, with optional recipe control and datalogging
Required Power (Typical, based on options)
400VAC, 3∅, 32A, 50/60Hz, 5-wire (3Ph+N+E)
Compliance
CE, optional CSA and UL
Warranty
12 months upon receipt, extended warranty is available at additional cost
KJLC Dual Wedge Tool turns your single substrate in to multiple substrates without the need for breaking vacuum or complex masking. This Combinatorial (producing multiple substrates with different materials and thicknesses on a single substrate) approach cuts down expensive and prolonged research time allowing for large amounts of substrate variations to be completed in days instead of months.
The KJLC wedge tool can help deposited films of material with n number of variations in addition to shadow mask. n is number of columns and its width can be programmed.
Example: 6 step (or six columns) deposition of various thickness of a "Material" or 6 deposition of different materials of same thickness or various thicknesses.
The substrate can be ROTATED 90, 180 or 270 degrees in the cassette and repeat the above wedge operation.
Using the KJLC dual wedge tool in combination with the rotation/orientation of the substrate will result in nxn depositions. In example given a total of 36 can be prepared with straightforward operation of the dual wedge and substrate rotation.
Architecture Overview
Kurt J. Lesker Company® eKLipse™ Controls Software is utilized on all KJLC platforms. The eKLipse™ controls platform utilizes a .NET application running on a Windows PC for its User Interface and Recipe Editor. Equipment automation is accomplished via a standalone Real Time Controller.
Recipes
- Graphical Recipe Builder – Easily create recipes by clicking on the desired component and set that item's attributes
- Scripted Recipe Builder – A more traditional "scripted" recipe editor exposes more details for setting or checking the value of any system component during a process.
Reliable
- Real Time Controller – The system operates independently of the Windows software package and will continue the recipe should the software / computer malfunction.
- Independent Thermal Evaporation Thin Film Control – There is no third party software requiring a "handshake" or "handoff" between the Systems Manufacturers software and the thin film controller's software.
Unlimited Recipes, (import/export capable)
- Unlimited recipes with user security level features
- Recipe import/export capability (for transferring recipes between similarly equipped tools)
- Any recipe step can be configured to allow the user to alter a value, enabling process condition changes, without affecting the master recipe. As an example, at the time of execution, the recipe can prompt the user for the desired deposition thickness, or power setting.
- Consistent User experience across all deposition techniques and KJLC platforms (Sputter, Thermal, EBeam, ALD)
- Multi chamber and multi PC control for cluster tools
Custom Chart Recorder and Datalogging
- Custom Chart with up to 10 simultaneous plots
- Chart Recorder can be used to display any setpoint or feedback parameter
- Automatic datalogging of each recipe step for all recipes
- Chart data and configuration can be saved
- Graphical selection of signals to be recorded
Custom Maintenance Counters
- Custom Maintenance Counters are available for each component
- Periodic Maintenance interlocks and recipe checks can be configured for any maintenance counter
- Sputter Target kiloWatt*Hour and custom material usage tracking
User Security
- Supports multiple user accounts and password levels with custom security access for recipes and screens
- Software screen access can be customized per user
- Recipe editing and manual operation features can be assigned on a per user basis;
- Users with full access have the ability to edit recipes and control interlocks. Restricted access users will be limited to running certain recipes and have no control over interlocks.
- Every control object can be assigned to a standard user security level.
- Individual screen access can be separately assigned to any user.
Multi User Facility Features
- System event log captures all user login/logout events, all recipes executed, and system status messages
- Interlocking of vacuum and deposition equipment provides continuous system status monitoring while restricting unapproved system usage (no need to 'power off' system screen or PC)
Remote Support Utility and Apps
- Customized Version of TeamViewer allows remote support (free Android and IOS apps)
- Remote connection supports system monitoring/control and file transfer
