Glove Box Interfaced Systems
Magnetron Sputtering Sources
3
6
8
8+
Thermal Evaporation Sources
4
4
6
4
Low Temperature Evaporation Sources (LTE)
4
4
12
12
Electron Beam Source
N/A
Multi Pocket, 5kW or 10kW Power Supplies
Multi Pocket, 5kW or 10kW Power Supplies
Multi Pocket, 5kW or 10kW Power Supplies
Platen
150mm Substrates
- Heating Up to 350°C
- Water-Cooling
150mm Round or 100mm x 100mm Square Substrates
- Heating Up to 850°C
- Water-Cooling
- RF Bias
200mm Round or 150mm x 150mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
200mm Round or 200mm x 200mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
Load Lock
N/A
Single or Multi-Cassette
Single or Multi-Cassette
Single or Multi-Cassette
Software
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
Full eKLipse™ Control Software/Hardware Suite
NANO 36Affordable Glove Box Integrated Sputtering, Thermal or Low Temperature Evaporation System
More InfoMagnetron Sputtering Sources
3Thermal Evaporation Sources
4Low Temperature Evaporation Sources (LTE)
4Electron Beam Source
N/APlaten
150mm Substrates
- Heating Up to 350°C
- Water-Cooling
Load Lock
N/ASoftware
Full eKLipse™ Control Software/Hardware SuiteMini SPECTROSOrganic Thin Film Deposition & Metallization System up to 100mm x 100mm Substrate
More InfoMagnetron Sputtering Sources
6Thermal Evaporation Sources
4Low Temperature Evaporation Sources (LTE)
4Electron Beam Source
Multi Pocket, 5kW or 10kW Power SuppliesPlaten
150mm Round or 100mm x 100mm Square Substrates
- Heating Up to 850°C
- Water-Cooling
- RF Bias
Load Lock
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware SuiteMagnetron Sputtering Sources
8Thermal Evaporation Sources
6Low Temperature Evaporation Sources (LTE)
12Electron Beam Source
Multi Pocket, 5kW or 10kW Power SuppliesPlaten
200mm Round or 150mm x 150mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool
Load Lock
Single or Multi-CassetteSoftware
Full eKLipse™ Control Software/Hardware SuiteSuper SPECTROSOrganic Thin Film Deposition & Metallization System up to 200mm x 200mm Substrate
More InfoMagnetron Sputtering Sources
8+Thermal Evaporation Sources
4Low Temperature Evaporation Sources (LTE)
12Electron Beam Source
Multi Pocket, 5kW or 10kW Power SuppliesPlaten
200mm Round or 200mm x 200mm Square Substrates
- Heating Up to 850°C
- -10°C Cooling
- RF Bias
- Insitu Mask Changing
- Single/Dual Wedge Tool