PVD-BATCH DRUM SERIES

DC Power Supplies:

• When sputtering conductive materials, DC power is a simple, economic option.
• Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn.

Sputtering Rates: Conductive materials with good thermal properties can be sputtered at higher power densities. This results in generally higher sputtering rates resulting in higher throughput.

RF Power Supplies:

• When sputtering non-conductive materials and ceramics.
• Examples of materials that can be sputtered with RF power includes: Al₂O₃, SiO₂, HfC, LiF, ZnO.

Material stoichiometry is maintained much easier than with reactive sputtering.

Sputtering Rates: RF power density is generally 1/3 of DC due to the higher frequency of RF power. In most non-conductive materials, the sputtering rates are much lower than conductive materials based on their material properties.

Pulsed DC Power Supplies:

• When sputtering in a reactive mode, pulsed DC provides the most effective solution.
• Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn (all conductive materials).

Reactive Depositions will adversely affect DC power supplies. Pulsed DC power supplies eliminate Poisoning typically seen in straight DC processes. However, due to lower duty cycling, rates are typically lower with Pulsed DC.

HIPIMS Power Supplies:

• HIPIMS enables the ability to achieve high density, hard coatings, and DLC coating properties.
• Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn (all conductive materials).

Extremely dense, non-porous films are generated as a result of the ionized plasma produced with High Impulse Magnetron sputtering power supplies. For more examples of power types that can be used with target materials - please reference our deposition materials chart.