PRO Line PVD 75
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PRO Line PVD 75
Versatile Sputtering, Electron Beam, & Thermal Evaporation Thin Film Deposition System Platform
The Kurt J. Lesker Company® PRO Line PVD 75 is the next generation thin film deposition system based on the workhorse PVD 75 platform. With more than 400 units in service worldwide, the PVD 75 is a proven, robust, and versatile design. The PRO Line PVD 75 builds on the successes of the original design with improved system base pressures and pump down times. A technically superior chamber design, an industry best software control system with advanced programming capability, automatic substrate loading, and numerous features for optimized thin film performance are a few of the key advantages offered in this innovative, best of class design.
Specifications
Chamber
Box Shaped 304L Stainless Steel Chamber
Internal Dimensions:
15.25" Wide x 16.50" Deep x 24" High
(387.4mm x 419.1mm x 609.6mm)
Aluminum, O-Ring Sealed, Hinged, Front Access Door
Deposition Techniques
Thermal Evaporation
Up To Four, 4" Individual Boats, Or Six 2" Boat Assemblies
TORUS Magnetron Sputtering Sources
Up To Six 2" or 3" Sources
Up To Four 4" Sources
Electron Beam Evaporation Source
4 Pocket 8cc
8 Pocket 12cc
6 Pocket 20cc
LTE10 Organic Deposition Sources
Up to Two, 10cc Sources
Deposition Orientation
Thermal Evaporation
Up
TORUS Magnetron Sputtering Sources
Up, Down, or Side-Sputter
Electron Beam Evaporation
Up
LTE Organic Deposition
Up
Substrate Manipulation
Rotation, Heating, Cooling, Bias, Load Lock Compatible
Power Supplies
DC, PDC, RF, MF, and HIPIMS Power Supplies
PVD 75 Open Frame
PVD 75 with Load Lock
PVD 75 Dual Chamber
PUMPING PERFORMANCE
The PRO Line PVD 75 offers two types of high vacuum pumping on its process chamber a Pfeiffer 790 L/s turbomolecular pump as standard or an optional Brooks CTI-8F 1500 L/s cryo pump. Either pump is an option for any of the deposition configurations for the PRO Line PVD 75. The Pfeiffer 790 L/s being a good choice for overall cost effective high quality pumping particularly for sputtering applications. The Brook CTI-8F finding use in applications that require the lowest vacuum possible particularly for thermal evaporation and electron beam applications.
The chart to the right demonstrates average expected pumping performance by pump type for an outfitted PRO Line PVD 75 process chamber that is clean and dry with (3) TORUS 3" Mag-keeper sources installed and a 3' long 1.5" metal flex bellows roughing line.
The PVD 75 was re-designed to mount the high vacuum valve directly to the process chamber without the 4" half nipple and now accommodates a larger 790 L/s pump or CTI8 pump. This allows the PRO Line PVD 75 to reach lower base pressures and faster pumpdown times than similarly equipped systems.
DEPOSITION PERFORMANCE
TORUS® Magnetron Sputtering Sources
The PRO Line PVD 75 is one of Kurt J. Lesker's most versatile thin film deposition systems offering single and multi-technique deposition options including thermal evaporation, magnetron sputtering (TORUS), and electron beam.
Only KJLC offers Mag-Keeper sputter sources with zero o-rings in the cathode body and a magnetically coupled target to allow for easy target changes. Our "patent pending" cooling well design enables operation at power densities UP TO 200 watts/.in2 (material dependent). This cathode is designed to sputter up to a 0.375" thick targets. Without a hold down clamp or dark space shield this cathode is capable of running as low as ≤ 1mTorr. The unique dome shutter design eliminates the need for additional cross contamination shielding required with standard flip or swing shutters.
To learn more about sputtering rates and uniformity, click here.
E-Beam Sources
KJLC E-beam sources are also designed to eliminate unnecessary o-rings, seals, and feedthroughs to lower pumpdown times and provide excellent base pressures. Only three feedthrough's are required for the KJLC E-beam source and there is no dynamic water to vacuum o-ring seal in this design which greatly reduces the risk of a water leak in the vacuum chamber.
Thermal Evaporation Sources
Thermal evaporation sources typically centered on the substrate fixture have been moved to the outer edges of the fixture to allow for better uniformities. The fixtures allow a source adjustment of up to an inch to allow for optimization to a particular application.
Typical Deposition Uniformities
| Sources | Wafer size | Uniformity |
|---|---|---|
The PRO Line PVD 75 has been designed for optimal uniformities and allows ultimate base pressures otherwise not achievable in modular R&D systems until now. The chart to the left shows average expected uniformity by deposition type and substrate wafer diameter. Thickness measurements were made using a Profilometer or spectral reflectometer. The actual uniformity achievable will be a function of the final configuration of the system and process parameters.
TORUS® sources are operated at typical sputtering pressures (< 20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Ã…. Al Target run with DC Power, film thickness >=1500Ã…. Ni Target run with High Strength TORUS® & DC Power, film thickness >=1500Ã….
KJLC electron beam deposition runs utilize Si wafers for deposition. Ti evaporant material with film thickness >=1500Ã….
- All Films are measured on a properly calibrated Profilometer, Reflectometer or Ellipsometer (if applicable).
- Measurement points are taken starting at the center of the substrate and then radially outward every 0.5 inches (12.7mm), nominally (reference figure to the right).
- Uniformity calculation formula is: ((Max - Min) / (2 x Avg)) x 100% with a 0.2 inch (5mm) edge exclusion.
PUMPING OPTIONS
High Vacuum Pumping Options
- Cryo Pump – CTI-8F 1500 L/sec cryo pump. Base pressure for a properly conditioned chamber is 5.0 x 10-8 torr (6.67 Ã – 10-8 mbar).
- Turbo Pump – A 790 L/sec turbo pump. Base pressure for a properly conditioned chamber is 5.0 x 10-7 torr (6.67 Ã – 10-7 mbar).
- Turbo Pump – A 1250 L/sec turbo pump. Base pressure for a properly conditioned chamber is 8.0 x 10-8 torr (1.07 Ã – 10-7 mbar).
The Cryo Pump is preferred where water vapor is a main process concern or lower base pressures are necessary.
The Turbo pump options are preferred for applications where gasses must be exhausted from the system.
Rough Vacuum Pumping Options
- Oil Pump – KJLC 7.6cfm (12.9 m3/hr).
- Dry Pump – Edwards nXDS10i – 6.7 cfm (11.4 m3/hr) Scroll roughing pump.
- Dry pump – Edwards XDS35i – 25 cfm (43 m3/hr) Scroll roughing pump.
The Oil Sealed Pump is an economical choice for applications where hydrocarbon oils are not a concern for the application.
The Dry Pump options are preferred for applications cleanliness of the application is required.
Downstream Pressure Control
- A variable position gate valve allows one to adjust the throttle while keeping a constant flow of gasses to the process chamber.
- Up to four Fujikin FCST1000F Mass Flow controllers and a 100mTorr Capacitance Manometer.
This option is preferred for reactive sputtering depositions where precise gas composition is required to achieve the desired stoichiometry for the deposited film.
Upstream Pressure Control
- Every PVD system is provided with a 3-position valve allowing one to manually set the third position to throttle the pumping speed.
- Up to four Fujikin FCST1000F Mass Flow controllers and a 100mTorr Capacitance Manometer.
This option is preferred for magnetron sputtering of metals or alloys.
DEPOSITION SOURCE OPTIONS
Standard & High Strength Magnet Arrays
-
Standard Strength: High Target Utilization, Optimized for Non-Magnetic Materials
ex. Metals and bonded ceramics -
High Strength: Optimized for highly coercive target materials
ex. Ni, Fe, Co, Permalloy
Magnetron Sputtering is a deposition technique that can be used to deposit all types of materials. It yields good uniformity and can provide optimal film quality through various techniques such as ion assist, HIPIMS, and source to substrate orientation.
TORUS® Magnetron Sputtering Source
- Up to six KJLC TORUS® 2" or 3" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available.
- Up to four KJLC TORUS® 4" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available
For more information on our new Mag Keeper sources please see the following link.
Thermal Evaporation Source
- KJLC Thermal evaporation (TE) assembly, Up to four 4" thermal evaporation sources (in sequential or co-deposition configurations)
- Standard thermal power supply up to 12V or 400A, max 2kW applied power
- High output power options up to 12V or 600A, max 2.5kW applied power
- KJLC 10cc LTE (Low Temperature Evaporation) source, suitable for Organic and low temperature materials (0-550°C)
- Quartz crystal controller is available with thermal options
Thermal Evaporation can be used to deposit both metallic and non-metallic materials ideally with lower melting temperatures. It is a low cost deposition technique that provides high deposition rates. The downside to thermal evaporation is its low film density and higher impurity levels.
Electron Beam Evaporation Source
- KJLC KL6, four pocket (8cc) E-Beam source
- KJLC KL8, eight pocket (12cc) or six pocket (20cc) E-Beam source
- 5kW or 10kW solid state power supply with programmable sweep and automatic crucible indexing
E-Beam deposition is a thermal evaporation process that utilizes a magnetically controlled electron beam to heat various materials. Due to the higher energy in E-Beam as opposed to Resistive thermal evaporation, it is better suited for depositing higher temperature materials.
E-Beam is a very focused deposition technique with a small coating zone. By adjusting the magnetics controlling the electron beam, it enables the ability to maximize material usage in the crucible.
MATERIALS DEPOSITED: POWER SUPPLIES
DC Power Supplies
- When sputtering conductive materials, DC power is a simple, economic option.
- Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn.
Sputtering Rates: Conductive materials with good thermal properties can be sputtered at higher power densities. This results in generally higher sputtering rates resulting in higher throughput.
RF Power Supplies
- When sputtering non-conductive materials and ceramics.
- Examples of materials that can be sputtered with RF power includes: Al2O3, SiO2, HfC, LiF, ZnO.
Material stoichiometry is maintained much easier than with reactive sputtering.
Sputtering Rates: RF power density is generally 1/3 of DC due to the higher frequency of RF power. In most non-conductive materials, the sputtering rates are much lower than conductive materials based on their material properties.
Pulsed DC Power Supplies
- When sputtering in a reactive mode, pulsed DC provides the most effective solution.
- Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn (all conductive materials).
Reactive Depositions will adversely affect DC power supplies. Pulsed DC power supplies eliminate Poisoning typically seen in straight DC processes. However, due to lower duty cycling, rates are typically lower with Pulsed DC.
HIPIMS Power Supplies
- HIPIMS enables the ability to achieve high density, hard coatings, and DLC coating properties.
- Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn (all conductive materials).
Extremely dense, non-porous films are generated as a result of the ionized plasma produced with High Impulse Magnetron sputtering power supplies. For more examples of power types that can be used with target materials - please reference our deposition materials chart.
Mid Frequency or Mid Frequency AC
- When sputtering in a reactive mode, Mid Frequency provides the fastest deposition rates possible.
- Examples of materials that can be sputtered with DC power includes: Al, Cu, Co, Hf, Mo, Ni, ITO, Zn (all conductive materials).
Extremely fast reactive deposition films are possible with a mid-frequency power supply. This will require two dedicated linear cathodes per power supply, but increases throughput dramatically.
RF BIAS Platen
- Provides 100W RF bias to the substrate fixture.
- Shared with sputter sources or dedicated power supply.
Provides the ability to lightly etch a substrate to remove native oxides before deposition.
Preferred when sputtering Oxides or Nitrides to crack the gas species for better film integration.
SUBSTRATE OPTIONS
Substrates
- Suitable for substrates up to 6" (150mm) in diameter
- 20 RPM, 850°C heat or water cooled
- Up to 100W RF bias
- Automated transfer
Reactive Depositions
- One Fujikin FCST1000F Mass Flow controller and a 100mTorr Capacitance Manometer
- Up to three Fujikin FCST1000F Mass Flow controllers for a reactive gas.
- Substrate gas ring is available
Ion Source
eH400, End-Hall permanent magnet ion source or KDC40 Gridded ion source
- eH400 End-hall source is a versatile ion source capable of high current, low energy ion cleaning or etching while limiting damage to substrate surfaces
- KDC40 Gridded ion source allows precise beam shaping with interchangeable ion optics and independent operation of important ion beam properties
Single Substrate Load Lock
- Low profile design
- Load Lock, turbo pump, and all appropriate gauging
- Compatible with substrates up to 150mm, multisite adapter for smaller substrates
- 67 L/s turbomolecular pump set with isolation valve
- Roughing pump shared with process chamber
- Isolation valve between load lock and process chamber
Architecture Overview
Kurt J. Lesker Company® eKLipse™ Controls Software is utilized on all KJLC platforms. The eKLipse™ controls platform utilizes a .NET application running on a Windows PC for its User Interface and Recipe Editor. Equipment automation is accomplished via a standalone Real Time Controller.
Recipes
- Graphical Recipe Builder – Easily create recipes by clicking on the desired component and set that item's attributes
- Scripted Recipe Builder – A more traditional "scripted" recipe editor exposes more details for setting or checking the value of any system component during a process.
Reliable
- Real Time Controller – The system operates independently of the Windows software package and will continue the recipe should the software / computer malfunction.
- Independent Thermal Evaporation Thin Film Control – There is no third party software requiring a "handshake" or "handoff" between the Systems Manufacturers software and the thin film controller's software.
Unlimited Recipes, (import/export capable)
- Unlimited recipes with user security level features
- Recipe import/export capability (for transferring recipes between similarly equipped tools)
- Any recipe step can be configured to allow the user to alter a value, enabling process condition changes, without affecting the master recipe. As an example, at the time of execution, the recipe can prompt the user for the desired deposition thickness, or power setting.
- Consistent User experience across all deposition techniques and KJLC platforms (Sputter, Thermal, EBeam, ALD)
- Multi chamber and multi PC control for cluster tools
Custom Chart Recorder and Datalogging
- Custom Chart with up to 10 simultaneous plots
- Chart Recorder can be used to display any setpoint or feedback parameter
- Automatic datalogging of each recipe step for all recipes
- Chart data and configuration can be saved
- Graphical selection of signals to be recorded
Custom Maintenance Counters
- Custom Maintenance Counters are available for each component
- Periodic Maintenance interlocks and recipe checks can be configured for any maintenance counter
- Sputter Target kiloWatt*Hour and custom material usage tracking
User Security
- Supports multiple user accounts and password levels with custom security access for recipes and screens
- Software screen access can be customized per user
- Recipe editing and manual operation features can be assigned on a per user basis;
- Users with full access have the ability to edit recipes and control interlocks. Restricted access users will be limited to running certain recipes and have no control over interlocks.
- Every control object can be assigned to a standard user security level.
- Individual screen access can be separately assigned to any user.
Multi User Facility Features
- System event log captures all user login/logout events, all recipes executed, and system status messages
- Interlocking of vacuum and deposition equipment provides continuous system status monitoring while restricting unapproved system usage (no need to 'power off' system screen or PC)
Remote Support Utility and Apps
- Customized Version of TeamViewer allows remote support (free Android and IOS apps)
- Remote connection supports system monitoring/control and file transfer
