Sputtering is a relatively mature approach for the deposition of a variety of thin film materials. Initial publications on the process date to the early 1800s. In its simplest form sputtering provides a route to manufacture high quality reflective coatings for mirrors and potato chip bags; and at the extreme end, for creating the most advanced semiconductor computing devices in the world.
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The Effect of Sputter Cathode Design on Deposition Parameters: Design Enhancements Expand Capabilities for the Magnetron Sputtering of Thin Films
July 22, 2019 | By KJLC Innovate
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Systems
Vacuum Science
Deposition Techniques
A Positive Kick Enhances the High Power Impulse Magnetron Sputter Process
March 15, 2019 | By KJLC Innovate
High impulse power magnetron sputtering, either HIPIMS or HiPMS, was first reported in 1999 by Dr. Vladimir Kouznetsov, et al. from Linköping University’s Department of Physics. HIPIMS is distinct from classical direct current magnetron sputtering, or dcMS, because it utilizes a rapid series of pulses at very high voltage, on the order of 2000V, and high current density approaching 10A/cm2. In addition, HIPIMS also exhibits some degree of self-sputtering, where sputter target adatoms are ionized with some recycling of process gas and ionized target material to the surface of the target.
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INNOVATE
Vacuum Science