Representative Image

KL-325K Silver Epoxy Glue

Note

Currently available for sale only in North America.

Silver-filled epoxy glue has high electrical and thermal conductivities.

Features

Often used to bond conducting sputter targets to a backing plate or connect heat-sensitive components to heat sinks, bonding waveguide plumbing, connecting ground wires to vacuum mounted components, and as a metal solder replacement.

NOTE: Shipped in two separate containers—epoxy glue and hardener. Mix together equal quantities of Part A and Part B on a clean surface (a tongue depressor or wooden toothpick work well for this). When the mixture has a uniform consistency, apply as required. One gram of epoxy will cover 1 sq. in. at 0.030"e; thickness.

Although warming any epoxy (between 50° C and 80° C) during curing shortens the curing time and increases the final bond strength, it leads to initially decreasing viscosity and may cause drips—leading to unintended seals and additional outgassing.

Specifications Table

Thermal Conductivity	25 x 10^-4 W/mK
Volume Resistivity	@25°C: 0.001 ohm-cm @100°C: N/A
Uncured Resin	Silver paste
Tensile Shear	@25°C: 1,200 - 2,500 psi
Shelf Life	@Room Temp.: 4-5 mo
Pot Life	@Room Temp.: 1-2 hours
Cure Cycle (After Mixing)	@25°C: 18hr @60°C: 2hr
Working Temperature	-60°C to 175°C

Shelf Life

It is strongly recommended using all fluids and greases at the time of receipt, however when storage is necessary, rotate older stock into use first and observe the recommended parameters listed below.

Epoxies

The KL-325 is marked with an expiration date 6 months from the date of manufacture. Store in the original sealed container at 25C temperature.