EC-R Series – Right-angle Deposition Stages
Substrate at a variable glancing angle to the mounting flange
Overview
- 2" to 6" substrate diameters
- Substrate heating to 1200°C
- Continuous azimuthal rotation up to 60rpm
- Polar rotation (tilt) up to +/- 180°
- DC/RF substrate biasing
- X,Y & Z motion options
- SiCg or sSiC heater technology
- True UHV performance
The EC-R provides substrate rotation, tilt, heating and electrical biasing with the substrate surface supported at right angles to the plane of the mounting flange. The base EC-R configuration provides polar rotation to adjust the angle of incidence with respect to the deposition flux and sample heating. The modular EC-R concept provides the flexibility to select options such azimuthal rotation to continuously rotate the substrate to maximize temperature and deposition uniformity. X, Y and Z motion can then be added to tailor the stage to meet your specific application. The concept of this stage was strongly influenced by a complete review of existing right angled deposition stages. By stacking two magnetically coupled 'MagiDrive' rotary feedthroughs, UHV Design are able to achieve a dual axis, concentric rotation system which eliminates the head positioning gear train typically used in other designs. Furthermore, by incorporating our latest heater module technology into this stage, improvements upon conventional designs have been achieved in ultimate temperature capability, uniformity and heater reliability. Refractory metal deposition shielding is provided as standard to protect the heating module.
The EC-R can also be configured specifically as a retrofit instrument for MBE systems such as the VG Semicon V80H.
The EC-R can be configured to suit your application:
Stage Configuration: EC-R Series
Standard configuration | ||||
Substrate diameter | 2"(50mm) | 100mm | 150mm | |
CF150/8" OD system flange | ✓ | x | x | |
CF200/10" OD system flange | ✓ | ✓ | x | |
CF250/12" OD system flange | ✓ | ✓ | ✓ | |
Polar Rotation | ||||
Adjustable position | Manual (1° resolution) | |||
Heating | ||||
Heater element | Silicon Carbide coated graphite (SiCg) as standard (see options below) | |||
Achievable temperature | 1200°C (based on heating a Molybdenum sample) |
Stage motion options | ||
Polar Rotation | ||
Stepper motorized | 0.025° resolution | |
Azimuthal Rotation | ||
Manually driven | Manual thimble | |
DC motorized | Up to 60rpm (maximum 20rpm recommended with bias) | |
Stepper motorized | Up to 60rpm (maximum 20rpm recommended with bias) | |
XYZ Motion Options | XL-T Range | XL-R Range |
Z axis | ||
Z stroke range offered | 50-300mm | 50-1000mm |
Resolution manual | 0.01mm | 1mm |
Resolution stepper motorized | 0.001mm | 0.001mm |
XY axis | ||
Manual actuation | +/- 15mm (+/-21mm vector) | +/- 19mm (+/-27mm vector) |
X-Y resolution manual | 0.001mm | 0.01mm |
motorized actuation | +/- 14mm (+/-20mm vector) | +/- 18mm (+/-25.5mm vector) |
X-Y Resolution stepper motorized | 0.0025mm | 0.005mm |
Axis alignment | ||
Adjustable position (manual) | +/-2° | N/A |
Additional options | ||
DC & RF bias | DC bias ≤ 1kV, RF ≤ 40W (including dark space shielding) | |
Heater element | Solid Silicon Carbide (sSiC) | |
Insertion length (nominally 240mm) | Customer specified | |
Motorization | Stepper or Smart Motor (DC for azimuthal only) | |
X,Y and Z encoders | Option | |
Azimuthal home position sensor | Option | |
Temperature measurement | Type K or Type C thermocouple | |
Water cooling of head assembly (NOT substrate) to aid heat dissipation | Option |
KEY: ✓ = Substrate size can be accommodated on specified system flange
x = Not available
ECR Bayonet Substrate Transfer
Secure bayonet substrate transfer using UHV Design's magnetically coupled transfer arm.