Nickel (Ni) Pellets Evaporation Materials

Nickel (Ni) Pellets Overview

We sell these pellets and pieces by unit weight for evaporation use in deposition processes. These approximate materials prices are published to provide budgetary guidelines. Actual prices can vary and may be higher or lower, as determined by availability and market fluctuations. To speak to someone directly about current pricing, please click here .

Nickel (Ni) General Information

Nickel is a hard, lustrous, silvery-white metal. It has a density of 8.91 g/cc, a melting point of 1,453°C, and a vapor pressure of 10^-4 Torr at 1,262°C. Its key characteristics are malleability, ductility, and ferromagnetism and its polished surface resists tarnishing when exposed to air. It is the second most abundant element in earth's core next to iron. It is mainly used to make stainless steel, coins, and batteries. It can also be found in jewelry, but its presence has decreased due to skin allergies. When evaporated in vacuum, nickel can form a decorative coating on ceramic surfaces or a solder layer in circuit device fabrication. It is often sputtered to form layers in the production of magnetic storage media, fuel cells, and sensors.

Nickel (Ni) Specifications

† Magnetic material (requires special sputter source).

‡ One run only.

*** Alumina Coated.

**** Suggestion based on previous experience but could vary by process. Contact local KJLC Sales Manager for further information

Thermal Evaporation of Nickel (Ni)

Nickel can be evaporated via electron beam or thermal evaporation. However, e-beam is the preferred method for evaporation.

Thermally evaporating nickel is very difficult. Like titanium, it has a strong tendency to alloy with refractory metals. Attempting to thermally evaporate nickel out of a tungsten boat has proven futile. As the boat heats up and the nickel melts, it alloys with the boat, causing it to become brittle and crack shortly after exposure to the liquid nickel. Therefore, deposition is very limited.

Instead, we recommend an alumina coated, tungsten dimple boat such as our EVS9AAOW if using a KJLC^® system. The alumina acts as a barrier between the nickel and the tungsten, thus prolonging the life of the boat and increasing the amount of nickel deposition. Instead of wetting the boat, the nickel will form a ball on top of the alumina coating once it melts. Only four 1/8" diameter x 1/8" long pellets can be loaded safely into this boat at one time. These boats will fail often, lasting approximately 1-3 runs. Due to alumina's limited heat conduction abilities, more power will be required to achieve evaporation.

Using the EVS9AAOW, we are able to deposit relatively thick films (approximately 1 micron per evaporation run) at rates from 0-5 angstroms per second using two Kepco^© power supplies linked in parallel. The nickel only takes about 230A of current to melt and to start evaporating, but requires voltages greater than 4V to run at this current. Using only one Kepco power supply, the nickel will still evaporate at about 100% power output, but the rates will be closer to 1 Å/sec, and the film thickness will be limited to around 2,000 Å total before the rate begins to decrease.

The alternative option to using a boat would be to use an Al₂O₃ crucible with a crucible heater. The problem here is that it is very difficult to get to high enough temperatures to deposit the nickel. Crucibles rely on external heating, and there is only so much power that can be applied in order to raise the temperature to achieve deposition.

E-beam Evaporation of Nickel (Ni)

The best way to evaporate nickel is by electron-beam evaporation. We recommend using a FABMATE^® liner for the e-beam evaporation of nickel. However, Fabmate^® is limited to only one run. During evaporation, the nickel will melt and adhere to the crucible liner walls. Upon cooling and reheating (if it makes it that far), the difference in thermal contraction and expansion of the nickel and the Fabmate^® liner will cause immense stress on the liner, and it will crack. Experienced users are sometimes able to get multiple runs out of a Fabmate^® liner with slow ramp rates of ~0.1% power/sec both up and down.

An alternative to Fabmate^® would be a copper crucible liner. In our experience, using a copper crucible liner has proven to be a good way to e-beam evaporate nickel. Nickel melts at 1453°C which is very near to its evaporation temperature. It is important to note that power should be ramped slowly both up and down when conducting this method. Nickel also has an average thermal conductivity. As the temperature of the nickel pellets increases in the copper liner, the nickel melts in strata. In other words, the top pellets melt and form a layer which is in contact with the inner diameter of the liner. Heat then gets conducted along the length of this layer to the liners side walls without too much heat seeping to the layer of pellets underneath. Deposition rates are stable coming off this top melted layer of nickel. In our observation, the melted nickel does not stick to the side walls of the liner allowing users to remove the material. Power levels should be reasonable and repeatable with only a slight creep upward over repeated runs. There is no interaction between the liquid nickel and the copper liner.

A key process note is to consider the fill volume of the crucible liner. We find that the melt level of a material in the crucible directly affects the success of the crucible liner. Overfilling the crucible will cause the material to spill over and create an electrical short between the liner and the hearth. The outcome is cracking in the crucible liner. This is the most common cause of crucible liner failure. Placing too little material in the liner or evaporating too much material before refilling can be detrimental to the process as well. When the melt level is below 30%, the e-beam is likely to strike the bottom or walls of the crucible which immediately results in breakage. Our recommendation is to fill the crucible between 2/3 and 3/4 full to prevent these difficulties. However, even when following these fill guidelines, the Fabmate^® liner will fail during cooling. Crucible liners should be stored in a cool, dry place and always handled with gloves or forceps.

Nickel can also be run directly from the copper hearth of the e-gun. Because of this, some customers prefer to use a pre-machined slug (or starter source) that is directly placed in the hearth pocket. The two main benefits of using a starter source are ease of use and handling as well as superior packing density. In order to avoid broken crucible liners, we have had customers install starter sources directly in the hearth. A copper crucible liner is also a good option for customers operating shared systems where using a liner is required.

KJLC^® can produce these starter sources. Contact us by clicking here with your e-gun manufacturer, pocket size, and number of pockets in order for us to produce a quote.

E-beam Crucible Liner Fill Rate Calculator

Instructions for use:
Input the Crucible Liner Volume, Select Material (if not available in menu, manually input Material Density in g/cm³), and input fill rate %.

KJLC recommends a fill rate between 67-75%. Overfilling the crucible will cause the material to spill over and create an electrical short between the liner and the hearth causing the crucible to crack. Placing too little material in the crucible or allowing the melt level to get too low can be detrimental to the process as well. When the melt level is below 30%, the e-beam is likely to strike the bottom or walls of the crucible which immediately results in breakage.

The fill rate above assumes that the material is fully melted and does not take into account packing density. It should be noted that the crucible liner may need to be loaded multiple times, pre-melted, and topped off in order to achieve the final desired melt level/fill rate. When loading the crucible, do not load more than 80% of the height of the crucible liner.

This calculator is for estimation purposes only.

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Crucible Liner Volume (in cc):

Material:
-- Please Select -- Aluminum Aluminum Antimonide Aluminum Arsenide Aluminum Bromide Aluminum Carbide Aluminum Fluoride Aluminum Nitride Aluminum Oxide Aluminum Phosphide Aluminum, 1% Copper Aluminum, 1% Silicon Antimony Antimony Oxide Antimony Selenide Antimony Sulfide Antimony Telluride Arsenic Arsenic Oxide Arsenic Selenide Arsenic Sulfide Arsenic Telluride Barium Barium Chloride Barium Fluoride Barium Oxide Barium Sulfide Barium Titanate Beryllium Beryllium Carbide Beryllium Chloride Beryllium Fluoride Beryllium Oxide Bismuth Bismuth Fluoride Bismuth Oxide Bismuth Selenide Bismuth Sulfide Bismuth Telluride Bismuth Titanate Boron Boron Carbide Boron Nitride Boron Oxide Boron Sulfide Cadmium Cadmium Antimonide Cadmium Arsenide Cadmium Bromide Cadmium Chloride Cadmium Fluoride Cadmium Iodide Cadmium Oxide Cadmium Selenide Cadmium Sulfide Cadmium Telluride Calcium Calcium Fluoride Calcium Oxide Calcium Silicate Calcium Sulfide Calcium Titanate Calcium Tungstate Carbon Cerium Cerium (III) Oxide Cerium (IV) Oxide Cerium Fluoride Cesium Cesium Bromide Cesium Chloride Cesium Fluoride Cesium Hydroxide Cesium Iodide Chiolite Chromium Chromium (II) Bromide Chromium Boride Chromium Carbide Chromium Chloride Chromium Oxide Chromium Silicide Cobalt † Cobalt Bromide Cobalt Chloride Cobalt Oxide Copper Copper Chloride Copper Oxide Copper Sulfide Cryolite Dysprosium Dysprosium Fluoride Dysprosium Oxide Erbium Erbium Fluoride Erbium Oxide Europium Europium Fluoride Europium Oxide Europium Sulfide Gadolinium † Gadolinium Carbide Gadolinium Oxide Gallium Gallium Antimonide Gallium Arsenide Gallium Nitride Gallium Oxide Gallium Phosphide Germanium Germanium (II) Oxide Germanium (III) Oxide Germanium Nitride Germanium Telluride Glass, Schott^® 8329 Gold Hafnium Hafnium Boride Hafnium Carbide Hafnium Nitride Hafnium Oxide Hafnium Silicide Holmium Holmium Fluoride Holmium Oxide Inconel^® Indium Indium (I) Oxide Indium (I) Sulfide Indium (II) Sulfide Indium (II) Telluride Indium (III) Oxide Indium (III) Sulfide Indium (III) Telluride Indium Antimonide Indium Arsenide Indium Nitride Indium Phosphide Indium Selenide Indium Tin Oxide Iridium Iron (II) Oxide Iron (III) Oxide Iron † Iron Bromide Iron Chloride Iron Iodide Iron Sulfide Kanthal Lanthanum Lanthanum Boride Lanthanum Bromide Lanthanum Fluoride Lanthanum Oxide Lead Lead Bromide Lead Chloride Lead Fluoride Lead Iodide Lead Oxide Lead Selenide Lead Stannate Lead Sulfide Lead Telluride Lead Titanate Lithium Lithium Bromide Lithium Chloride Lithium Fluoride Lithium Iodide Lithium Niobate Lithium Oxide Lutetium Lutetium Oxide Magnesium Magnesium Aluminate Magnesium Bromide Magnesium Chloride Magnesium Fluoride Magnesium Iodide Magnesium Oxide Manganese Manganese (II) Oxide Manganese (III) Oxide Manganese (IV) Oxide Manganese Bromide Manganese Chloride Manganese Sulfide Mercury Mercury Sulfide Molybdenum Molybdenum Boride Molybdenum Carbide Molybdenum Oxide Molybdenum Silicide Molybdenum Sulfide Neodymium Neodymium Fluoride Neodymium Oxide Nichrome IV^® Nickel † Nickel Bromide Nickel Chloride Nickel Oxide Nickel/Iron † Nimendium † Niobium Niobium (II) Oxide Niobium (III) Oxide Niobium (V) Oxide Niobium Boride Niobium Carbide Niobium Nitride Niobium Telluride Niobium-Tin Osmium Osmium Oxide Palladium Palladium Oxide Parylene Permalloy^® † Phosphorus Phosphorus Nitride Platinum Platinum Oxide Plutonium Polonium Potassium Potassium Bromide Potassium Chloride Potassium Fluoride Potassium Hydroxide Potassium Iodide Praseodymium Praseodymium Oxide PTFE Radium Rhenium Rhenium Oxide Rhodium Rubidium Rubidium Chloride Rubidium Iodide Ruthenium Samarium Samarium Oxide Samarium Sulfide Scandium Scandium Oxide Selenium Silicon Silicon (II) Oxide Silicon (IV) Oxide Silicon (N-type) Silicon (P-type) Silicon Boride Silicon Carbide Silicon Nitride Silicon Selenide Silicon Sulfide Silicon Telluride Silver Silver Bromide Silver Chloride Silver Iodide Sodium Sodium Bromide Sodium Chloride Sodium Cyanide Sodium Fluoride Sodium Hydroxide Spinel Strontium Strontium Chloride Strontium Fluoride Strontium Oxide Strontium Sulfide Strontium Titanate Sulfur Supermalloy^® † Tantalum Tantalum Boride Tantalum Carbide Tantalum Nitride Tantalum Pentoxide Tantalum Sulfide Technetium Tellurium Terbium Terbium Fluoride Terbium Oxide Terbium Peroxide Thallium Thallium Bromide Thallium Chloride Thallium Iodide Thallium Oxide Thorium Thorium Bromide Thorium Carbide Thorium Fluoride Thorium Oxide Thorium Oxyfluoride Thorium Sulfide Thulium Thulium Oxide Tin Tin Oxide Tin Selenide Tin Sulfide Tin Telluride Titanium Titanium (II) Oxide Titanium (III) Oxide Titanium (IV) Oxide Titanium Boride Titanium Carbide Titanium Nitride Tungsten Tungsten Boride Tungsten Carbide Tungsten Disulfide Tungsten Oxide Tungsten Selenide Tungsten Silicide Tungsten Telluride Uranium Uranium (II) Sulfide Uranium (III) Oxide Uranium (IV) Oxide Uranium (IV) Sulfide Uranium Carbide Uranium Fluoride Uranium Phosphide Vanadium Vanadium (IV) Oxide Vanadium (V) Oxide Vanadium Boride Vanadium Carbide Vanadium Nitride Vanadium Silicide Ytterbium Ytterbium Fluoride Ytterbium Oxide Yttrium Yttrium Aluminum Oxide Yttrium Fluoride Yttrium Oxide Zinc Zinc Antimonide Zinc Bromide Zinc Fluoride Zinc Nitride Zinc Oxide Zinc Selenide Zinc Sulfide Zinc Telluride Zirconium Zirconium Boride Zirconium Carbide Zirconium Nitride Zirconium Oxide Zirconium Silicate Zirconium Silicide
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Density of the material in g/cm³:

Fill Rate %:

Result

See highlighted results that match your result in the table below.

Material Needed to Deposit a 1 Micron Film Calculator

Instructions for use:
Select source type, input distance from source to substrate and Select Material (if not available in menu, manually input Material Density in kg/m³).

This calculator is for estimation purposes only. The estimated mass is that needed to produce a desired film thickness (1 micron in this case) on a flat substrate at a point directly above the source, accounting for the approximate plume distribution of the selected source type. It does not account for any expected nonuniformity in thickness over a larger substrate area. More complex geometries, e.g. those with offset and/or tilted sources, may have higher material requirements. The estimated mass is for the film deposition only; additional margin should be included to account for loss during ramp-up, burn-in, stabilisation and ramp-down.

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Source:
Point Directional - Thermal Boat Directional - EBeam Directional - LTE/HTE

Distance of source to substrate (in cm):

Material:
-- Please Select -- Aluminum Aluminum Antimonide Aluminum Arsenide Aluminum Bromide Aluminum Carbide Aluminum Fluoride Aluminum Nitride Aluminum Oxide Aluminum Phosphide Aluminum, 1% Copper Aluminum, 1% Silicon Antimony Antimony Oxide Antimony Selenide Antimony Sulfide Antimony Telluride Arsenic Arsenic Oxide Arsenic Selenide Arsenic Sulfide Arsenic Telluride Barium Barium Chloride Barium Fluoride Barium Oxide Barium Sulfide Barium Titanate Beryllium Beryllium Carbide Beryllium Chloride Beryllium Fluoride Beryllium Oxide Bismuth Bismuth Fluoride Bismuth Oxide Bismuth Selenide Bismuth Sulfide Bismuth Telluride Bismuth Titanate Boron Boron Carbide Boron Nitride Boron Oxide Boron Sulfide Cadmium Cadmium Antimonide Cadmium Arsenide Cadmium Bromide Cadmium Chloride Cadmium Fluoride Cadmium Iodide Cadmium Oxide Cadmium Selenide Cadmium Sulfide Cadmium Telluride Calcium Calcium Fluoride Calcium Oxide Calcium Silicate Calcium Sulfide Calcium Titanate Calcium Tungstate Carbon Cerium Cerium (III) Oxide Cerium (IV) Oxide Cerium Fluoride Cesium Cesium Bromide Cesium Chloride Cesium Fluoride Cesium Hydroxide Cesium Iodide Chiolite Chromium Chromium (II) Bromide Chromium Boride Chromium Carbide Chromium Chloride Chromium Oxide Chromium Silicide Cobalt † Cobalt Bromide Cobalt Chloride Cobalt Oxide Copper Copper Chloride Copper Oxide Copper Sulfide Cryolite Dysprosium Dysprosium Fluoride Dysprosium Oxide Erbium Erbium Fluoride Erbium Oxide Europium Europium Fluoride Europium Oxide Europium Sulfide Gadolinium † Gadolinium Carbide Gadolinium Oxide Gallium Gallium Antimonide Gallium Arsenide Gallium Nitride Gallium Oxide Gallium Phosphide Germanium Germanium (II) Oxide Germanium (III) Oxide Germanium Nitride Germanium Telluride Glass, Schott^® 8329 Gold Hafnium Hafnium Boride Hafnium Carbide Hafnium Nitride Hafnium Oxide Hafnium Silicide Holmium Holmium Fluoride Holmium Oxide Inconel^® Indium Indium (I) Oxide Indium (I) Sulfide Indium (II) Sulfide Indium (II) Telluride Indium (III) Oxide Indium (III) Sulfide Indium (III) Telluride Indium Antimonide Indium Arsenide Indium Nitride Indium Phosphide Indium Selenide Indium Tin Oxide Iridium Iron (II) Oxide Iron (III) Oxide Iron † Iron Bromide Iron Chloride Iron Iodide Iron Sulfide Kanthal Lanthanum Lanthanum Boride Lanthanum Bromide Lanthanum Fluoride Lanthanum Oxide Lead Lead Bromide Lead Chloride Lead Fluoride Lead Iodide Lead Oxide Lead Selenide Lead Stannate Lead Sulfide Lead Telluride Lead Titanate Lithium Lithium Bromide Lithium Chloride Lithium Fluoride Lithium Iodide Lithium Niobate Lithium Oxide Lutetium Lutetium Oxide Magnesium Magnesium Aluminate Magnesium Bromide Magnesium Chloride Magnesium Fluoride Magnesium Iodide Magnesium Oxide Manganese Manganese (II) Oxide Manganese (III) Oxide Manganese (IV) Oxide Manganese Bromide Manganese Chloride Manganese Sulfide Mercury Mercury Sulfide Molybdenum Molybdenum Boride Molybdenum Carbide Molybdenum Oxide Molybdenum Silicide Molybdenum Sulfide Neodymium Neodymium Fluoride Neodymium Oxide Nichrome IV^® Nickel † Nickel Bromide Nickel Chloride Nickel Oxide Nickel/Iron † Nimendium † Niobium Niobium (II) Oxide Niobium (III) Oxide Niobium (V) Oxide Niobium Boride Niobium Carbide Niobium Nitride Niobium Telluride Niobium-Tin Osmium Osmium Oxide Palladium Palladium Oxide Parylene Permalloy^® † Phosphorus Phosphorus Nitride Platinum Platinum Oxide Plutonium Polonium Potassium Potassium Bromide Potassium Chloride Potassium Fluoride Potassium Hydroxide Potassium Iodide Praseodymium Praseodymium Oxide PTFE Radium Rhenium Rhenium Oxide Rhodium Rubidium Rubidium Chloride Rubidium Iodide Ruthenium Samarium Samarium Oxide Samarium Sulfide Scandium Scandium Oxide Selenium Silicon Silicon (II) Oxide Silicon (IV) Oxide Silicon (N-type) Silicon (P-type) Silicon Boride Silicon Carbide Silicon Nitride Silicon Selenide Silicon Sulfide Silicon Telluride Silver Silver Bromide Silver Chloride Silver Iodide Sodium Sodium Bromide Sodium Chloride Sodium Cyanide Sodium Fluoride Sodium Hydroxide Spinel Strontium Strontium Chloride Strontium Fluoride Strontium Oxide Strontium Sulfide Strontium Titanate Sulfur Supermalloy^® † Tantalum Tantalum Boride Tantalum Carbide Tantalum Nitride Tantalum Pentoxide Tantalum Sulfide Technetium Tellurium Terbium Terbium Fluoride Terbium Oxide Terbium Peroxide Thallium Thallium Bromide Thallium Chloride Thallium Iodide Thallium Oxide Thorium Thorium Bromide Thorium Carbide Thorium Fluoride Thorium Oxide Thorium Oxyfluoride Thorium Sulfide Thulium Thulium Oxide Tin Tin Oxide Tin Selenide Tin Sulfide Tin Telluride Titanium Titanium (II) Oxide Titanium (III) Oxide Titanium (IV) Oxide Titanium Boride Titanium Carbide Titanium Nitride Tungsten Tungsten Boride Tungsten Carbide Tungsten Disulfide Tungsten Oxide Tungsten Selenide Tungsten Silicide Tungsten Telluride Uranium Uranium (II) Sulfide Uranium (III) Oxide Uranium (IV) Oxide Uranium (IV) Sulfide Uranium Carbide Uranium Fluoride Uranium Phosphide Vanadium Vanadium (IV) Oxide Vanadium (V) Oxide Vanadium Boride Vanadium Carbide Vanadium Nitride Vanadium Silicide Ytterbium Ytterbium Fluoride Ytterbium Oxide Yttrium Yttrium Aluminum Oxide Yttrium Fluoride Yttrium Oxide Zinc Zinc Antimonide Zinc Bromide Zinc Fluoride Zinc Nitride Zinc Oxide Zinc Selenide Zinc Sulfide Zinc Telluride Zirconium Zirconium Boride Zirconium Carbide Zirconium Nitride Zirconium Oxide Zirconium Silicate Zirconium Silicide
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Density of the material in kg/m³:

Multiplier:

Mass for 1 micron layer